Description:
Duties The major duties of this position focus on developing measurement platforms that can quantify the generation of generation and impact of residual stress in the polymeric underfill and compression molding resins that are used as semiconductor packaging applications. These packaging resins are dispensed as monomeric liquids or soft pastes, but cross-link into a thermoset polymer when heated. The conversion from a soft liquid to a rigid thermoset is accompanied by volumetric shrinkage. As t
Apr 9, 2024;
from:
dice.com